Wafer Baking Oven is used for automatic production of shaped or flat wafers.
Pattern and thickness of wafer molds are designed depending on customer request.
The molds in which the wafer is baked are designed as Natural Gas, LPG or Electric.
Wafer cooking time varies between 2 minutes and 3.5 minutes depending on the thickness of the leaf and the recipe. Cast burner is used to save energy in the gas system. The burner provides an even distribution on the cooking surface with its right and left movements.
The heating system is automatically ignited and can be easily monitored from the control panel.
There is a frequency controlled main motor in the Wafer Baking Oven.
Dough pouring frequency controlled impler pump is used. It is ensured that the dough is poured evenly into the molds in the desired weight.
Adjustable automatic take-up system ensures smooth flow of leaves to the next leaf cooling machine. The bead cleaning system at the bottom can be controlled automatically or manually from the control panel.
With the automatic heat control device, the temperature values of the molds can be easily monitored from the control panel.
All the outer covers of the wafer baking oven are made of stainless steel.
The fork tensioning system is provided with pneumatic control.
The gas system is covered with stainless covers to prevent damage.
WAFER MOLD AND LOCK SYSTEM TYPES
OVEN 290 X 470 – 44 MOLDS 18 – 20 pcs/min Butterfly lock system
OVEN 290 X 470 -60 MOLD 24 – 26 pcs / min Butterfly lock system
OVEN 350 X 470 – 60 MOLDS 25 – 28 pcs/min Hook lock system
OVEN 350 X 470 – 80 MOLD 34 – 36 pcs/min Hook lock system
OVEN 350 X 470 – 90 MOLD 40 – 42 pcs/min Hook lock system
OVEN 350 X 500 – 60 MOLDS 25 – 28 pcs/min Hook lock system
OVEN 350 X 500 – 80 MOLDS 34 – 36 pcs/min Hook lock system
FIRIN 350 X 500 – 90 KALIPLI 40 – 42 ad/dk Kancalı kilit sistemi
The wafer baking oven is used for fully automatic production of flat or shaped wafers. Baking molds can be optionally designed to create fine or medium depth patterns on the wafer sheet. Baking molds are heated with natural gas or LPG or, if desired, with electricity. The cooking time can be adjusted between 2 minutes and 3.5 minutes depending on the recipe and the desired wafer sheet thickness, the average cooking time is 2.3 minutes. The system is equipped with energy-saving burners. Each burner is moved around its own axis, ensuring equal heat distribution over the entire cooking surface. The entire heating system is automatically ignited and monitored by the monitor. Oven; frequency controlled main motor, frequency controlled impeller pump used for dough dispensing, automatic leaf removal system, automatic temperature control device, stainless steel coating, closed exhaust hood on dough dispensing station, pneumatically controlled automatic tong tension system, bottom bead cleaning system, control panel and equipped with control cabinet.